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战斗力 鹅
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注册时间 2014-6-12
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没办法 goldencove太适合人民群众喜欢跑的东西了 只好当作不存在了 当年11代牙膏厂不也一样
顺便看外网大佬分析 积热更严重了 当然笔记本平台也会把牙膏厂抛得更远
Consequences
The doubling of transistor density at the heat generating sections of the die has a major impact on the cooling of the chip. Cache has a comparatively low heat output per area, while logic is where the hotspots are located. Due to thermal limits at the logic hotspots, there is increasing use of “dark silicon”, meaning a lower percentage of transistors can be switching and producing heat at any one time.
Cooling Challenge
Ryzen 7000 Desktop will therefore represent the ultimate cooling challenge seen thus far. The die can approach 2 Watts/mm² if your cooler is up to the task. The smaller heatspreader area on Ryzen 7000 package design only makes things worse. We discussed the cooling difficulty and why the heatspreader is smaller in our Computex piece in May.
Due to the cooling difficulty and higher power limits on Ryzen 7000 Dekstop, the philosophy has changed to follow a more laptop-like approach. Instead of fixing a clockspeed or power limit, the processor is now temperature limited. This means maximizing performance for a given cooling capability. The processor will adjust to stay within the temperature limits. This also means a more significant performance difference that changes with cooling ability.
Competitiveness
AMD’s client desktop processors remain the weakest in their line-up compared to Intel. Outright performance for the money lags behind while being much more difficult to cool than Intel’s offerings. Ryzen 7000’s 5nm process significantly increases production costs and risks eroding margins as it is difficult to increase ASPs commensurately in such a competitive environment. Mandatory DDR5 on the new AM5 platform will also have some impact on uptake due to a much higher base platform cost. |
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楼主: omnitoken
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发表于 2022-8-30 08:48
